Specific Process Knowledge/Thin film deposition/Deposition of NiV

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Sputtering of Nickel Vanadium

Nickel Vanadium may be sputter deposited in either Sputter-system (Lesker)

In the chart below you can compare the different deposition equipment.

	Sputter deposition (Sputter-System Lesker)
General description	Sputter deposition of NiV
Pre-clean	RF Ar clean
Layer thickness	About 10Å to 5000Å
Deposition rate	Depending on process parameters.
Batch size	Pieces or 1x4" wafer or 1x6" wafer
Allowed substrates	Silicon wafers Quartz wafers
Allowed materials	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals Carbon
Comment	Sputter target with NiV composition: Ni/V 93/7%