Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum

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Molybdenum deposition

Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	Sputter deposition (Lesker)
General description	E-beam deposition of Mo	Sputter deposition of Mo
Pre-clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 0.5 µm*	10Å to 500 Å
Deposition rate	2Å/s to 15Å/s	Depends on process parameters, roughly about 1 Å/s
Batch size	Up to 1x4" wafers smaller pieces	Pieces or 1x4" wafer or 1x6" wafer
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8
Comment

* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.