Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Sputter rates for Al

Deposition rate of Al sputtering in the Wordentec

Deposition rate, film uniformity and grain size of Al depends on the process parameters ( mainly on power and pressure) during the sputtering process.

From the experiment which set Pressure 10^-3 mbar, Power 150 W

The deposition rate is established to be 1.6 Å/s (in the center of the wafer, 1.4 Å/s at the edge).

(Measured October 2008, KNIL).