Specific Process Knowledge/Etch/DRIE-Pegasus/processA/PrA-2
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Date | Substrate Information | Process Information | SEM Images | |||
---|---|---|---|---|---|---|
Wafer info | Exposed area | Conditioning | Recipe | Wafer ID | ||
2/5-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C03991.03 | |
2/5-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C03991.06 | |
3/6-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C04047.03 | |
3/6-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C04047.06 |