Specific Process Knowledge/Back-end processing/Disco Saw

Disco Automatic dicing saw, model DAD321

The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.

A rough overview of the performance Disco DAD321 Dicer

Purpose	Equipment for dicing out samples.	Pure Silicon samples Silicon bonded to Silicon Silicon bonded to Pyrex/Borofloat Pyrex/Borofloat
Performance	X-axis cutting range	192 mm
.	.	50 Å to 262 µm
.	Resolution xy	down to 0.067 µm
.	Resolution z	1Å, 10Å or 20Å
.	Max. scan depth as a function of trench width W	1.2(W[µm]-5µm)
Hardware settings	Tip radius	5 µm 45^o cone
Substrates	Substrate size	up to 6"
.	Substrate material allowed	In principle all materials

Comparing dicing parameters for different materials

	Silicon	Pyrex or bonded Si/Pyrex
Bladetype	HUB Blade ZH05 (27HEEF)	HUBless Blade B1A862
Cutlinewidth	60 µm	150 µm
Recommended feed speed	Up to 5 mm/sec	Up to 2 mm/sec
Recommended dice depth	Leave 200 µm uncut. It's possible to cut through the sample.	Leave 200 µm uncut. It's possible to cut through the sample.
Max. sample thichness	not any limits	not any limits
Index accuracy	not known	not known
Wavelength range	400-1000 nm	300-950 nm
What kind of thin films can be measured	Any film that is transparent to the light in the given wavelength range ex: Silicon Oxide Silicon nitride PolySilicon Photoresists SU8 Other polymers Very thin layers of metals (<20 nm) and many more	Any film that is transparent to the light in the given wavelength range ex: Silicon Oxide Silicon nitride Very thin layers of PolySilicon Photoresists SU8 Other polymers Very thin layers of metals (<20 nm) and many more