Specific Process Knowledge/Wafer cleaning/RCA

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Revision as of 08:43, 21 February 2008 by Louise (talk | contribs) (New page: The RCA clean is used for cleaning the wafers before taking them into the furnaces. It consist of two solutions: RCA1 and RCA2 The RCA1 contains H2O, NH4OH and H2O2 (5:1:1). It is used fo...)
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The RCA clean is used for cleaning the wafers before taking them into the furnaces. It consist of two solutions: RCA1 and RCA2

The RCA1 contains H2O, NH4OH and H2O2 (5:1:1). It is used for removed of light organics, partiticles and metal.

The RCA2 cantains H20, HCl and H2O2 (5:1:1). It is used for removel of heavy metals, alkalis and metal hydroxides.

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