Specific Process Knowledge/Wafer cleaning/7-up & Piranha
| 7-up | Piranha | |
|---|---|---|
| General description |
Etch of pure Gold with or without photoresist mask. |
Etch of pure Gold (as stripper). |
| Chemical solution | KJ:J:HO (100g:25g:500ml) | HCl:HNO (3:1) |
| Process temperature | 20 oC | 20 oC |
| Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
Unmasked - used as a stripper |
| Etch rate |
~100 nm/min |
~(??) nm/min - fast etch |
| Batch size |
1-5 4" wafers at a time |
1-5 4" wafer at a time |
| Size of substrate |
2-6" wafers |
2-6" wafers |