Specific Process Knowledge/Wafer cleaning/IMEC

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Ikke godkendt

IMEC process for cleaning of wafers before fusion bonding:

Ophav IMEC Spørg Karen om der er lavet modificeringer

Step Process Details Comments Comments
1 Pre bonding cleaning of Si wafers with cavities and SOI wafers with nitride Use wafers with cavities on and SOI wafers
  • Takes 1½ hours
  • Orient flat to minimize handling
  • Preferable done just before bonding!
Get CLEAN box for wafers!!!
2 Piranha Mixture: H2SO4:H2O2 (4:1)

Temp: 80 oC Time: 5 min (a yellow and a black spot)

Clean tank (cleanroom 4) and make your own or make in dedicated glass.

Pour up H2SO4 first, put wafers in carrier (USE this in steps4.1-4.6), add H2O2, wait 30 sec, dip wafers.

Maybe clean the tank the day before!

Put into dedicated wet box for IMEC

3 Rinse 2 min. rinse Put into dedicated wet box for IMEC
4 IMEC DI water:5% HF:isopropanol (100:10:1)

Temp: 25 oC Time: 100 sec (two black spots)

Clean tank (cleanroom 4) and make your own, it needs 2 bottles

Bottles are in service room 2 on the left, pump is by Leica microscope in cleanroom 3

Bottle for mixing is in service room 2, use BHF pump from RCA fumehood!

Put into dedicated wet box for IMEC

5 Rinse 2 min. rinse
6 Piranha Not nitride wafers!

Mixture: H2SO4:H2O2 (4:1) Temp: 80 oC Time: 20 min

Re-use previous piranha

Makes wafers hydrophilic

Put into dedicated wet box for IMEC
7 Rinse & spin dry 5 min rinse Put into dedicated wet box for IMEC
8 Put wafers in new clean carrier box