Specific Process Knowledge/Etch/RIE (Reactive Ion Etch)

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Revision as of 13:11, 18 September 2007 by BGE (talk | contribs) (New page: == Etching using the dry etch technique RIE (Reactive Ion Etch) == Here at Danchip we have three RIE's. One (III-V RIE) for etching III-V materials and two (RIE1 and RIE2) for etching sil...)
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Etching using the dry etch technique RIE (Reactive Ion Etch)

Here at Danchip we have three RIE's. One (III-V RIE) for etching III-V materials and two (RIE1 and RIE2) for etching silicon based materials (silicon, silicon oxide, sillicon nitride). The hardware of RIE1 and RIE2 is very similar not you cannot count on that identical recipes on RIE1 and RIE2 perform exactly the same. Except from the the main difference