Specific Process Knowledge/Wafer cleaning/IMEC

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The user manual, user APV and contact information can be found in LabManager: Buffered HF-Wetting agent/IMEC info page in LabManager


IMEC process for cleaning of wafers before fusion bonding:

Based on the IMEC clean process: M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.
Has been slightly modified by Karen Birkelund.

Step Process Details Comments Comments
1 Pre-bond cleaning of Si wafers prior to fusion bonding. .
  • Takes 1½ hours
  • Orient flat to minimize handling
  • Preferable done just before bonding!
Get CLEAN box for wafers!!!
2 Piranha Mixture: H2SO4:H2O2 (4:1)

Temp: 80 oC Time: 5 min (a yellow and a black spot)

Clean tank (cleanroom B1, 7-up bath for wafers) and make your own or make in dedicated glass.

Pour up H2SO4 first, put wafers in carrier (USE this in steps 2-7), add H2O2, wait 30 sec, dip wafers.

Maybe clean the tank the day before!
3 Rinse 2 min. rinse . Put into dedicated wet box for IMEC
4 IMEC DI water:5% HF:isopropanol (100:10:1)

Temp: 25 oC Time: 100 sec (two black spots)

Clean tank (cleanroom D-3, tank for buffer with wetting solution) and make your own. Mix in dedicated bottle (IMEC) in fume hood and add to tank using BHF pump from RCA fumehood!

.

5 Rinse 2 min. rinse Put into dedicated wet box for IMEC .
6 Piranha Not nitride wafers!

Mixture: H2SO4:H2O2 (4:1) Temp: 80 oC Time: 20 min

Re-use previous piranha

Makes wafers hydrophilic

.
7 Rinse & spin dry 5 min rinse . .
8 Put wafers in new clean carrier box . . .