File:Steamer process develop fig2.png

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Revision as of 11:26, 29 September 2014 by Paphol (talk | contribs) (The average silicon dioxide thickness and the percent of film non-uniformity over the wafer variation with process time, steamer flow rate and temperature.)
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The average silicon dioxide thickness and the percent of film non-uniformity over the wafer variation with process time, steamer flow rate and temperature.

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current11:26, 29 September 2014Thumbnail for version as of 11:26, 29 September 2014527 × 324 (17 KB)Paphol (talk | contribs)The average silicon dioxide thickness and the percent of film non-uniformity over the wafer variation with process time, steamer flow rate and temperature.

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