Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Stress Wordentec Ni films
Stess in Wordentec deposited Nickel films
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Thin films of Ni has tensile stress. It was examined if different deposition rates result in a difference in stress in Wordentec deposited Ni films and the result is presented here.
Rate dependence
The rate was changed between the depositions. In most cases 200 nm of Ni was deposited.
| Deposition rate (Å/s) | Stress, average (MPa) | Thickness (nm) | Comment | Deposition date | |
| Tesile | Compressive | ||||
| 15 Å/s* |
|
200 | vvvvvvvvvvvvvvvvvvvvvvvvv | 08-01-2014 | |
| 10 Å/s | R | R | R | R | R |
| 7 Å/s | 1 | 1 | 1 | R | R |
| 3 Å/s | 2 | 1 | A | R | R |
| 1 Å/s* | . | O | O | O | O |
The stress measurements presented in the table were performed the same day as the deposition.
* Before changing the deposition rates to 15 Å/s or 1 Å/s first contact responsible Danchip staff. These deposition rates are not recommended for all thicknesses and applications.
Time dependence
Further it was seen that the stress in the films decreases with time. The stress in the Ni films was measured on the same wafer at different days and for the wafers deposited with 15 Å/s the film stress decreased over time.