Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Stress Wordentec Ni films

Stess in Wordentec deposited Nickel films

Section is under construction.

Thin films of Ni has tensile stress. It was examined if different deposition rates result in a difference in stress in Wordentec deposited Ni films and the result is presented here.

The rate was changed between the depositions. In most cases 200 nm of Ni was deposited.

Deposition rate (Å/s)	Stress, average (MPa)		Thickness (nm)	Comment	Deposition date
	Tesile	Compressive
15 Å/s			200	vvvvvvvvvvvvvvvvvvvvvvvvv	08-01-2014
10 Å/s	R	R	R	R	R
7 Å/s	1	1	1	R	R
3 Å/s	2	1	A	R	R
1 Å/s	.	O	O	O	O

The stress measurements presented in the table were performed the same day as the deposition.

Time dependence

Further it was seen that the stress in the films decreases with time.