Specific Process Knowledge/Thin film deposition/Deposition of Silver/Deposition of Silver

Thermal deposition of Silver

Silver can be thermally evaporated in Wordentec. Use process number 22 in the process list.

Only the thickness needs to be changed. The deposition rate is set to 2.5 Å/s (contact responsible danchip personel if you like to run with a different rate).

Additional information - process parameters that NOT need to be changed

Here below are the process parameters of the Ag program listed. These are already in the program and do not need to be changed- this is written as a back-up to have a list with all process parameters.

(These parameters are listed in material 13 Ag the material section: - please contact the process specialist if you are not familiar with this.) For thermal Ag deposition use:

Max power: 6.7 % (With a higher max power, the deposition rate will have large fluctuations).

Soak power 1: 4 %

Soak power 2: 6.6 %

Soak time 2: 1 min

This gives a depositon rate of about 2.5 Å/s (to be set in the process parameters).

To get the right thickness measurement of the quartz crystals, use the prameters

Density: 10.5 (thermal evap. of Al 2.7)

Z-ratio: 0.529 (thermal evap. of Al 1.08)

Master Tooling should be set to: 120% (to get the requested layer thickness on the wafer). (Master tooling for Al = 167%).

10 pellets (1/8" diameter x 1/8" long) were placed in the boat before the evaporation processes were started. About 5000 Å could be deposited from that amount.