Specific Process Knowledge/Etch/Etching of Gold
Etching of Gold
Etching of Gold is done wet at Danchip. We have two different solutions:
- KI:IFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O - 400g:100g:400ml?
- HNOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3} :HCl - 1:3
Comparing the two solutions
| Iodine based gold etch | Aqua Regia (Kongevand) | |
|---|---|---|
| General description |
Etch of pure Gold |
Etch of pure Gold |
| Chemical solution | KJ</math>:JFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O<math> 100g:25g:500ml | |
| Process temperature | 50 oC | 20 oC |
| Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
| Etch rate |
~100 nm/min (Pure Al) |
~60(??) nm/min |
| Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
| Size of substrate |
4" wafers |
4" wafers |
| Allowed materials |
|
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