Specific Process Knowledge/Etch/Etching of Gold

Etching of Gold

Etching of Gold is done wet at Danchip. We have two different solutions:

	Iodine based gold etch	Aqua Regia (Kongevand)
General description	Etch of pure Gold	Etch of pure Gold
Chemical solution	K $J$ :J $_{2}$ :H $_{2}$ O<math> 100g:25g:500ml
Process temperature	50 ^oC	20 ^oC
Possible masking materials:	Photoresist (1.5 µm AZ5214E)	Photoresist (1.5 µm AZ5214E)
Etch rate	~100 nm/min (Pure Al)	~60(??) nm/min
Batch size	1-25 wafers at a time	1-25 wafer at a time
Size of substrate	4" wafers	4" wafers
Allowed materials	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist