Specific Process Knowledge/Thin film deposition/Deposition of Platinum

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Platinum deposition

Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	Sputter deposition (Lesker)
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	1x4" wafer or 1x6" wafer smaller pieces
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 5000Å*	10Å to 5000Å*	10Å to 5000Å
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s	? Å/s to ? Å/s
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals Carbon
Comment

* For thicknesses above 200 nm permission is required from Thin Film group.