Specific Process Knowledge/Wafer cleaning

From LabAdviser

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Clean with:

  • RCA - Two step process to remove organics and metals
  • 7-up & Piranha - Removes organics and alkali ions
  • 5% HF - Removing native oxide
  • IMEC - Cleaning before fusion bonding
  • Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom


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Comparison of Wafer Cleaning Methods

RCA 7-up & Piranha 5% HF IMEC Soap Sonic
Generel description Two step process to remove organics and metals Removes organics and alkali ions Removing native oxide Cleaning before wafer bonding Removing dust and particles
Purpose Mandatory prior furnace processes When needed and always after KOH etch and Nitride etch in Phosphoric acid Optional with RCA cleaning Cleaning before wafer bonding Cleaning very dirty items that enters the cleanroom.
Substrate size
  • #1-25 2", 4" and 6" wafers
  • #1-25 2", 4" and 6" wafers
  • #1-25 2", 4" and 6" wafers
  • #1-25 2" and 4" wafers
  • All sizes that can go into the bath
Allowed materials
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex and wafers with Cr ONLY in Mask cleaning bath or beaker
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxy-nitride
  • Quartz/fused silica
  • Resists (depending on bath)
  • Pyrex (depending on bath)
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex
  • All materials