Specific Process Knowledge/Thin film deposition/Deposition of NiV

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Nickel Vanadium can be deposited by sputter evaporation. In the chart below you can compare the different deposition equipment.


Sputter deposition (PVD co-sputter/evaporation) Sputter deposition (Sputter-System Lesker)
Batch size
  • 12x2" wafers or
  • 12x4" wafers or
  • 4x6" wafers
  • Pieces or
  • 1x4" wafer or
  • 1x6" wafer
Pre-clean RF Ar clean RF Ar clean
Layer thickness About 10Å to 4000Å About 10Å to 5000Å
Deposition rate Depending on process parameters. Depending on process parameters.
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Carbon
Comment Sputter target with NiV composition: Ni/V 93/7% Sputter target with NiV composition: Ni/V 93/7%
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