Specific Process Knowledge/Characterization/Thickness Measurer

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Thickness measurer

Digital Thickness Measurer. Positioned in cleanroom 4

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to ensure no over-etching by making a thickness measurement during the etching.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result have to be within ± 0.005 mm. The QC is preformed ones a year. The QC procedure The newest QC data

Equipment performance and process related parameters

Purpose	Thickness measurer	Wafer Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	>5 µm
Process parameter range	Process Temperature	Room temperature
	Process pressure	1 atm
Substrates	Batch size	One sample
	Substrate materials allowed	No restriction.