Specific Process Knowledge/Etch/Wet Platinum Etch
Ething of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with IBE by sputtering with Ar ions.
Platinum can be etched by the following wet etch:
- HCl : HNO3 : H2O (7 : 1 : 8) at 85 °C
At this moment we do not have any information on the etch rate. You should be aware that this wet etch will also etch gold and it is not possible to use any masking material, it is used as a stripper.
Use the fumehood in cleanroom 2 for the setup. Use a glass beaker. Write content on beaker and which metals has been etched with yellow permanent pen.
Platinum Etch data
| Platinum wet etch | |
|---|---|
| General description |
Etch of Platinum |
| Link to safety APV | see APV here. |
| Chemical solution | HCl : HNO3 : H2O (7 : 1 : 8) |
| Process temperature | 85 °C |
| Possible masking materials | None |
| Etch rate | Mainly used as stripper |
| Batch size | 1-7 4" wafers at a time |
| Size of substrate | Any that fits into a carrier that can go into the glass beaker |
| Allowed materials | No restrictions.
Make a note on the beaker of which materials have been processed. |