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07:27, 30 July 2015 Bghe talk contribs uploaded File:Box2 no1a 90dg 13.jpg (MsUpload)
07:27, 30 July 2015 Bghe talk contribs uploaded File:Box1 no10 90dg 05.jpg (MsUpload)
07:27, 30 July 2015 Bghe talk contribs uploaded File:Box1 no6 90dg 00.jpg (MsUpload)
07:27, 30 July 2015 Bghe talk contribs uploaded File:Box1 no3 90dg 03.jpg (MsUpload)
13:56, 29 July 2015 Bghe talk contribs uploaded File:Box1 no9 tilt0ny2 49.jpg (MsUpload)
10:31, 29 July 2015 Bghe talk contribs uploaded File:Box2 no2 tilt0ny 45.jpg (MsUpload)
10:31, 29 July 2015 Bghe talk contribs uploaded File:Box2 no2 tilt0ny 44.jpg (MsUpload)
10:30, 29 July 2015 Bghe talk contribs uploaded File:Box2 no1 tilt0ny2 47.jpg (MsUpload)
10:30, 29 July 2015 Bghe talk contribs uploaded File:Box2 no1 tilt0ny2 46.jpg (MsUpload)
10:30, 29 July 2015 Bghe talk contribs uploaded File:Box1 no10 tilt0ny2 48.jpg (MsUpload)
10:29, 29 July 2015 Bghe talk contribs uploaded File:Box1 no9 tilt21 19.jpg (MsUpload)
10:29, 29 July 2015 Bghe talk contribs uploaded File:Box1 no9 tilt21 17.jpg (MsUpload)
14:40, 27 July 2015 Bghe talk contribs uploaded File:Box1 no8 tilt0 31.jpg (MsUpload)
14:40, 27 July 2015 Bghe talk contribs uploaded File:Box1 no8 tilt0 30.jpg (MsUpload)
14:40, 27 July 2015 Bghe talk contribs uploaded a new version of File:Box1 no7 tilt0 33.jpg (MsUpload)
14:40, 27 July 2015 Bghe talk contribs uploaded a new version of File:Box1 no7 tilt0 32.jpg (MsUpload)
14:37, 27 July 2015 Bghe talk contribs uploaded File:Box1 no7 tilt0 33.jpg (MsUpload)
14:37, 27 July 2015 Bghe talk contribs uploaded File:Box1 no7 tilt0 32.jpg (MsUpload)
14:35, 27 July 2015 Bghe talk contribs uploaded File:Box1 no6 tilt0 35.jpg (MsUpload)
14:35, 27 July 2015 Bghe talk contribs uploaded File:Box1 no6 tilt0 34.jpg (MsUpload)
14:32, 27 July 2015 Bghe talk contribs uploaded File:Box1 no5 tilt21 20.jpg (MsUpload)
14:30, 27 July 2015 Bghe talk contribs uploaded File:Box1 no4 tilt21 10.jpg (MsUpload)
14:28, 27 July 2015 Bghe talk contribs uploaded File:Box1 no3 tilt0 29.jpg (MsUpload)
14:28, 27 July 2015 Bghe talk contribs uploaded File:Box1 no3 tilt0 28.jpg (MsUpload)
14:22, 27 July 2015 Bghe talk contribs uploaded File:Box1 no2 tilt21 04.jpg (MsUpload)
14:22, 27 July 2015 Bghe talk contribs uploaded File:Box1 no2 tilt0ny2 55.jpg (MsUpload)
14:20, 27 July 2015 Bghe talk contribs uploaded File:Box1 no1 tilt0ny2 56.jpg (MsUpload)
14:20, 27 July 2015 Bghe talk contribs uploaded File:Box1 no1 tilt0 26.jpg (MsUpload)
14:18, 27 July 2015 Bghe talk contribs uploaded File:Box1 no1 tilt0ny2 56.tif (MsUpload)
14:18, 27 July 2015 Bghe talk contribs uploaded File:Box1 no1 tilt0 26.tif (MsUpload)
13:54, 26 June 2015 Bghe talk contribs uploaded File:Monthly LabAdviser update 20150626.docx (MsUpload)
07:20, 26 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/Photolithography/Photoresist developer/AZ developer 351 (content was: "There are 2 developer baths, develop 1 and develop 2, witch are the same. Here are some main rules for developer baths use: *Before using a one of developer batch's please check the "Lithography logbog1" to find out when they were us...")
07:20, 26 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/Photolithography/Photoresist developer/SU8 developer (content was: "==SU8 developer== 300x300px|thumb|SU8 developer: positioned in cleanroom 3 SU-8 developer is only for wafers with SU-8 resist. There are 2 baths with PGMEA (Propylene Glycol Methyl Ether Acetate). Her...")
15:29, 10 June 2015 Bghe talk contribs deleted page Electroplating-Cu (content was: "= The mobile plating unit = The Mobile Plating-Unit includes a process unit necessary for the Cu-electroplating as well as a pump with display, tank, heating syste..." (and the only contributor was "Lynhen"))
15:39, 2 June 2015 Bghe talk contribs uploaded File:Under etch.jpg (MsUpload)
15:39, 2 June 2015 Bghe talk contribs uploaded File:Si etch rate.jpg (MsUpload)
15:39, 2 June 2015 Bghe talk contribs uploaded File:Si etch angle.jpg (MsUpload)
15:39, 2 June 2015 Bghe talk contribs uploaded File:Line width.jpg (MsUpload)
15:39, 2 June 2015 Bghe talk contribs uploaded File:Resist etch rate.jpg (MsUpload)
13:33, 2 June 2015 Bghe talk contribs uploaded File:RIE2 Travka.pdf (MsUpload)
14:31, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy/FEI/Detectors (content before blanking was: "=== Detectors on the FEI SEM=== The FEI SEM has 6 electron detectors and 1 photon (X-ray) detector. * ETD: In chamber SE Detector (Everhardt Thornley Detector) */TLD| TLD: Inlens SE detector (Through Lens Dete...")
14:30, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy/FEI/Detectors/ETD (content was: "The ETD detector is a standard HiVac detector of secondary electrons" (and the only contributor was "Jml"))
12:05, 1 June 2015 Bghe talk contribs deleted page E-beam lithography (content was: "#REDIRECT Specific Process Knowledge/E-beam lithography" (and the only contributor was "BGE"))
11:59, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/JEOL E-beam Writer (content was: "300x300px|thumb|JEOL E-beam writer: positioned in cleanroom 4 - the E-beam writer room The E-beam Writer is a lithography tool. The very short wavelength of 100 kV electrons makes it possible to focus an...")
11:57, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Spinning e-beam resist (content was: "Spinning e-beam resists demands some special precondition. First of all spinning and post backing must be done with the equipments placed in fume hood, which gives good exhaust. The cleanness of surroundings and the right behavior during...")
11:56, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Coating with Thermal Aluminium (content was: "For non-conductive samples, such as glass or quartz wafers, a charge dissipation layer is required on the top of the E-beam resist, for reduction of electrostatic charging of the surface of the substrate. You can keep the wafers with ZEP...")
11:56, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/TEBN1 (content was: "TEBN1 is a negative tone e-beam writer resist with very high resolution and very low sensitivities. the maximum resit thickness can be achieved by spin coating is 40nm. the typical dose needed for exposure is around 5000µc/cm2</sup...")
11:55, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/SAL601 (content was: "SAL601 is a negative tone, chemical amplified e-beam resist. It has good sensitivity (80µc/cm2 at 100kV). the resolution is around 100nm. Develope: *MF322: 5 to 8 min *Rinse by DI water: 30 sec")
11:55, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/ZEP520A (content was: "ZEP520A belongs to ZEP520 series of e-beam resists. 520 series are high performance positive e-beam resist which show high resolution, high sensitivity and high dry etch resistance. Resists of this series are suitable for various e-beam ...")
11:54, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Develop e-beam resist (content was: "===Zep520A develop=== Standard recipe for developing: # N50, 2min for develop # IPA 30sec for rinse # N2 blow dry or spin dry Note: Zep520A have a large tolerance on development time. for the resist thickness less than 150 n...")