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- 12:41, 19 June 2014 Bghe talk contribs deleted page Specific Process Knowledge/III-V Process/etch/plasys/III V RIE ETCHES (content was: "==CHF3/O2 etch== A plasma with a gas mixture of CHF<sub>3</sub> and O<sub>2</sub> is used to etch SiO<sub>2</sub> and Si<sub>3</sub>Ni<sub>4</sub> dielectricas; flour radicals are responsible for etching the dielectrica while oxygen rem...")