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• 13:43, 5 May 2025 Bghe talk contribs deleted page Specific Process Knowledge/Lithography/ARP617 (content before blanking was: "Test of copolymer AR-P 617.05; a positive e-beam resist from AllResist. This copolymer is meant to be used as a sacrificial layer in a bi- or tri-layer e-beam resist stack (i.e. bottom layer). The copolymer adheres well on many substrates and can be dry-etched isotropically (to create under-cut) and anisotropically by reactive ion etch. Furthermore, it is softbaked at temperatures above 200 degrees and thus themally stable to many post-processing steps. This is...")