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• 14:53, 2 January 2023 Eves talk contribs created page Specific Process Knowledge/Thin film deposition/Deposition of Tungsten/HiPIMS Sputtering of W in Sputter-system Metal-Nitride (PC3) (Created page with "Tungsten (W) can be deposited using either e-beam or sputtering methods (at DTU Nanolab). The e-beam method is challenging since a lot of power is involved and focused on the target. This can potentially destabilize the chamber, due to heat generation and the rapid pressure increase. To avoid that a low deposition rate (0.5 Å/s - 1 Å/s) and limited thicknesses have to be selected. The resulting film usually suffers from low density (porosity) and high oxygen levels. On...")