Specific Process Knowledge/Thin film deposition/Deposition of Silicon

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Revision as of 11:04, 21 November 2007 by 192.38.87.73 (talk) (New page: PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace. Tin can be deposited by e-beam evaporation. In the chart below you can compare the different depositio...)
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PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace.

Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


Sputter (Alcatel) Furnace PolySi
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 8x4" wafers or
  • 5x6" wafers
Pre-clean RF Ar clean Ar ion bombartment
Layer thickness 10Å to 1µm 10Å to 1500Å
Deposition rate 2Å/s to 15Å/s 1Å/s to 5Å/s
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