Specific Process Knowledge/Characterization/Topographic measurement
Topographic measurements are measurements were you can measure hight differences on your substrate. If you measure in many spots of you substrate you can get a topographic image of your substrate.
AT DANCHIP we have three systems for topographic measurement:
- Tencor - Profiler for measuring micro structures
- Dektak - Profiler for measuring micro structures
- Nanoman - AFM for measuring nano structures
| Tencor | Dektak | Nanoman | |
|---|---|---|---|
| General description | Profiler for measuring micro structures | Profiler for measuring micro structures. Can do wafer mapping | AFM for measuring nanostructures and surface roughness |
| Substrate size | 4" or less | 8" or less | 6" or less |
| Max. scan range xy | Line scan x: Full substrate size | Line scan x: 50µm to 200mm | 90 µm square |
| Max. scan range z | 50Å to 262µm | 1 µm (can go up to 5 µm under special settings) | |
| Resolution xy | |||
| Resolution z | |||
| Min. feature size | |||
| Max. aspect ratio | ~1 with standard cantilever. | ||
| Tip radius | 5 µm | <12 nm on standard cantilever |