Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace
C4 Furnace Aluminium Anneal
C4 Furnace Anneal is a Tempress horizontal furnace for annealing of silicon wafers with Aluminium.
This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. In this furnace it is allowed to enter wafers that contains aluminium. Check the cross contamination chart. If you are in doubt, please send a mail to furnace@danchip.dtu.dk.
The user manual(s), technical information and contact information can be found in LabManager:
Process knowledge
- Annealing: look at the Annealing page
| Purpose | Annealing | Annealing of wafers containing aluminium. |
|---|---|---|
| Performance | Film thickness | |
| Process parameter range | Process Temperature |
|
| Process pressure |
| |
| Gas flows |
| |
| Substrates | Batch size |
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| Substrate material allowed |
Silicon wafers with alluminium. Wafers are allowed after alluminium lift off or after alluminium etch and resiststrip in acetone |