Specific Process Knowledge/Thin film deposition/Deposition of Silver

Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	Thermal evaporation (Wordentec)	E-beam evaporation (PVD co-sputter/evaporation)
Batch size	Up to 1x4" wafers smaller pieces	6x6" wafers or 6x4" wafers or 24x2" wafers	4x6" wafers or 4x4" wafers or 2x2" wafers
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 0.5µm (0.5µm not on all wafers)	10Å to 1000Å
Deposition rate	2Å/s to 15Å/s	1Å/s to 10 Å/s	About 1Å/s

Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec