Specific Process Knowledge/Thin film deposition/Deposition of Tantalum

Tantalum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Leybold)	Sputter (Lesker)
Batch size	Up to 1x4" wafers smaller pieces	8x4" wafers or 5x6" wafers	up to 1x6" wafer
Pre-clean	RF Ar clean	Ar ion bombartment	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 1500 Å	10Å to
Deposition rate	2Å/s to 15Å/s	1Å/s to 5Å/s	~0.3Å/s