Specific Process Knowledge/Thin film deposition/Deposition of Gold
Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter (Lesker) | |
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Batch size |
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Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
Layer thickness | 10 Å to 1 µm | 10 Å to 1500 Å | 10 Å to 1 µm | 10 Å to |
Deposition rate | 2 Å/s to 15 Å/s | 1 Å/s to 5 Å/s | 1 Å/s to 15 Å/s |
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings