Specific Process Knowledge/Back-end processing/Disco Saw
Feedback to this page: click here
Disco Automatic dicing saw, model DAD321 and DAD3241
DTU nanolab has 2 saw available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.
The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.
In general it is not allowed to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions here to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.
Dicing layout
Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the entire wafer. Please see the illustrations for a good and a bad design.
| GOOD design - simple | GOOD design - complex | BAD design | |
 |
 |
|
|
| GOOD design - simple | GOOD design - complex | BAD design | |
| drawings by Jesper Hanberg, DTU Nanolab |
Process information
- The user manual, user APV, technical information and contact information can be found in LabManager:
Available blades
THIS CHAPTER IS WORK IN PROGRESS
DISCO provides a wide selection of dicing blades optimized for different materials. There catalogue can be accessed online here DTU Nanolab provides 2 different blades for 2 main use-cases