Specific Process Knowledge/Etch/Etching of Chromium

From LabAdviser

Wet etching of Chromium

Fume hood: positioned in cleanroom 2.
Wet Etch of Chromium can take place in a beaker in this fume hood

Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:

  1. HNOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O:cerisulphate - 90ml:1200ml:15g - standard at Danchip
  2. Commercial chromium etch

Etch rate are depending on the level of oxidation of the metal.

How to mix the Chromium etch 1:

  1. Take a beaker and add 15g of cerisulphate.
  2. Add a little water while stirring - make sure all lumps are gone.
  3. Add water until 600 ml - keep stirring (use magnetic stirring)
  4. Add 90 ml HNOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3}
  5. When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.



Overview of the data for the chromium etches

Chromium etch 1 Chromium etch 2
General description

Etch of chromium

Etch of chromium

Chemical solution HNOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O:cerisulphate - 90ml:1200ml:15g .
Process temperature Room temperature .
Possible masking materials

Photoresist (1.5 µm AZ5214E)

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Etch rate

~40-100 nm/min

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Batch size

1-25 wafers at a time

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Size of substrate

4" wafers

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Allowed materials

No restrictions. Make a note on the bottle of which materials have been processed.

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Dry etching of chromium

On the ICP Metal Etch tool a recipe for chromium is being developed.