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Specific Process Knowledge/Back-end processing/Wire Bonder/new page name

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TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire. The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire.


Table: HB100 Full Technical Specifications

HB100 Full Technical Specifications
Bonding Specifications Bonding Methods Wedge–Wedge, Ball–Wedge, Ribbon, Bump
Bond Head Capability One head for Wedge & Ball bonding (tool change only)
Wire Diameter (Gold) 12–75 µm (0.5–3 mil)
Wire Diameter (Aluminium) 17–75 µm (0.7–3 mil)
Wire & Ribbon Handling Ribbon Size Max. 25 × 250 µm (1 × 10 mil)
Wire Spool Size 2" diameter
Wire Feed Angle / Immersion Depth 90° deep access / 14 mm immersion
Ultrasonic & Bonding Parameters Ultrasonic Frequency 63.3 kHz PLL control (110 kHz option)
Ultrasonic Power 0–10 W
Bond Time 0–5 seconds
Bond Force 10–200 cN
Bonding Tool Size 1.58 mm Ø × 19 mm length (0.0624" × 0.750")
Wire Termination Bond Head Tear or Clamp Tear
Mechanics & Motion Control Z-Drive / Resolution Lead screw motor / 0.5 µm
Motorized Z Travel 100 mm (3.9")
X–Y Drive / Resolution Linear motors / 0.1 µm
Motorized X–Y Travel 100 mm (3.9")
Max. Component Width 400 mm (15.7")
Rotation Drive Accuracy ±0.5°
Control & Interface Axis Control Joystick
Screen Size 21" touchscreen
Software Environment Industrial PC with Windows
Camera & Optics Camera System Dual camera (detail + overview)
Magnification Up to 150×
View Mode Simultaneous detail & overview
Heater Stage Size 90 mm Ø surface (mechanical & vacuum clamping)
Temperature Range Up to 200 °C ±1 °C
Clamping Mechanical & vacuum

For detailed information on compatible wires and bonding tools for the HB100, visit the TPT Wires & Tools page.


Process parameters for Gold wire (25µm)