Specific Process Knowledge/Etch/DRIE-Pegasus

This page is under construction

1 SPTS Pegasus DRIE introduction

1.1 Identification of equipment

1.2 Equipment responsible

1.3 Location of equipment

1.4 Safety

1.5 Purpose

The DRIE-Pegasus etch tool is a state-of-the-art silicon etch tool. The combination of advanced hardware and software enables you to either use the optimized standard processes or to tailor etch processes for your specific needs.

1.6 Overview of equipment The load lock and MACS

2 Technical specifications

2.1 Wafer requirements

2.2 Hardware

2. 3 Standard processes

2.3.1 Process A Large trench

2.3.1 Process B Via etch

2.3.1 Process C Microstamp

2.3.1 Process D Nanostamp

3 Processing

3. System control

3.1 Manual processing

3.2 Automatic processing

4 Recipes

5 Datalogs

5 Process development

Go to the Danchip LabAdviser page to find the most recent process development.

6

8)  Processing guidelines and instructions
 8.1)  Bonding to a carrier wafer
  8.1.1)  Why use carrier wafers
  8.1.2)  How to bond to a carrier wafer
  8.1.3)  Processing a bonded wafer
 8.2)  Processing wafers with metal
  8.2.1)  Rules for allowing metals in the ASE
 8.3)  Recipes
9)  Operating instructions
 9.1)  Processing procedure
 9.2)  Setting the chuck temperature
 9.3)  Loading wafers
 9.4)  Processing
 9.5)  The sequencer
 9.6)  Chamber conditioning
 9.7)  Datalogs
10)  User maintenance and trouble shooting
 10.1)  Maintenance by users
 10.2)  Trouble shooting
 10.3)  Other information
  10.3.1)  Training
  10.3.2)  Literature
  10.3.3)  ASE acronyms