Specific Process Knowledge/Etch/DRIE-Pegasus

== This page is under construction ==

1 SPTS Pegasus DRIE introduction

1.1 Identification of equipment

1.2 Equipment responsible

1.3 Location of equipment

1.4 Safety

1.5 Purpose

1.6 Overview of equipment

2 Technical specifications

2.1 Wafer requirements

2.2 Hardware

2. 3 Standard processes

 7 .4)  Process parameters for the standard processes
 7.5)  Standardization procedure

3 Processing

3. System control

3.1 Manual processing

3.2 Automatic processing

4 Recipes

8)  Processing guidelines and instructions
 8.1)  Bonding to a carrier wafer
  8.1.1)  Why use carrier wafers
  8.1.2)  How to bond to a carrier wafer
  8.1.3)  Processing a bonded wafer
 8.2)  Processing wafers with metal
  8.2.1)  Rules for allowing metals in the ASE
 8.3)  Recipes
9)  Operating instructions
 9.1)  Processing procedure
 9.2)  Setting the chuck temperature
 9.3)  Loading wafers
 9.4)  Processing
 9.5)  The sequencer
 9.6)  Chamber conditioning
 9.7)  Datalogs
10)  User maintenance and trouble shooting
 10.1)  Maintenance by users
 10.2)  Trouble shooting
 10.3)  Other information
  10.3.1)  Training
  10.3.2)  Literature
  10.3.3)  ASE acronyms