Specific Process Knowledge/Back-end processing/Die Bonder

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The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.

Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information

• Au-Sn eutectic die bonding

Equipment performance and process related parameters

Equipment		Die bonder	Flip-chip bonder
Purpose		Fine placement of dies Eutectic metal soldering	Fine placement of dies Glue attachment
Performance		Low thermal resistance Always conducting	Medium or High thermal resistance Possibility of both conducting and isolating adhesives If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates	Allowed materials	Should be able to withstand the soldering temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)	Any that is compatible with the glue and temperature used