Specific Process Knowledge/Characterization/XRD

Feedback to this page: click here

XRD SmartLab

The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.

The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:

XRD SmartLab in LabManager

Process information

XRR

With X-Ray Reflectivity measurements, it is possible to obtain information on thickness, density, and both surface and interface roughness on thin films. The technique does not depend on crystal structure and can be used on both amorphous, poly-, and single-crystalline materials. For film thickness measurement, films op to around 100 nm can be measured. You are welcome to try it on thicker films, but please confirm the measurement the first time by use of other equipment. XRR is a special case of a Theta/2Theta measurement. Rigaku gives a good explanation of the principles behind the XRR in this paper.:File:X-ray thin film measurements techniques V X-ray reflectivity measurements.pdf

Software for analysis

The software packages used for data analysis are available on the equipment computer, but we recommend that you install it on your personal computer. To run the software you need a USB dongle with a license on, these can be borrowed from Rebecca and Kristian in room 347-077. We only have 9 dongles available, so when you are done please return the dongle to danchip.

The software can be found on "CleanroomDrive\_Equipment\XRD\Rigaku software\RILauncher", it should be possible to install the software without a dongle. To use the software you have to log in. The user is: Administrator. There is no password.

Equipment performance and process related parameters

Equipment		XRD SmartLab
Purpose	Crystal structure analysis and thin film thickness measurement	Phase ID Crystal Size Crystallinity Quality and degree of orientation 3D orientation Latice strain Composition Twist 3D lattice constant Thickness Roughness Density
X-ray generator	Maximum rated output	3 kW
	Rated tube voltage	20 to 45 kV
	Rated tube current	2 to 60 mA
	Type	Sealed tube
	Target	Cu
	Focus size	0.4x8 mm (Line/Point)
Goniometer	Scanning mode	incident / receiver coupled or independent
	Goniomenter radius	300 mm
	Minimum step size	0.0001° (0.36")
	Sample stage	χ:-5~+95° φ:0~360° Z:-4~+1 mm X,Y:±50 mm for a 100 mm wafer Rx,Ry:-5~+5°
	Sample size	Diameter: 150 mm Thickness: 0~21 mm
Optics	Incident side	Cross Beam Optics(CBO) Ge(220)x2 monochromator In-Plane Parallel Slit Collimator (PSC) Soller slit Variable divergence slit
Optics	Receiver side	Automatic variable scattering slit Automatic variable receiver slit Parallel slit analysers (PSA) Ge(220)x2 analyser
Substrates	Substrate size	up to 150 mm wafers
	Allowed materials	All materials