Specific Process Knowledge/Characterization/Probe station

Probe station

Probe station. Positioned in serviceroom CX1

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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

Equipment performance and process related parameters

Purpose	Thickness measurer	Wafer thickness Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	< 5 µm
Substrates	Batch size	One sample
	Substrate materials allowed	No restrictions

The user manual, technical information and contact information can be found in LabManager:

Probe station