Specific Process Knowledge/Wafer cleaning/IMEC
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The user manual, user APV and contact information can be found in LabManager: Buffered HF-Wetting agent/IMEC info page in LabManager
The IMEC process is used for cleaning of wafers prior to fusion bonding:
This procedure is based on the IMEC cleaning process: M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.
Has been slightly modified by Karen Birkelund.
| Step | Process | Details | Comments | Comments |
|---|---|---|---|---|
| 1 | Pre-bond cleaning of Si wafers prior to fusion bonding. | . |
|
Get CLEAN box for wafers!!! |
| 2 | Piranha | Mixture: H2SO4:H2O2 (4:1)
Temp: 80 oC Time: 5 min (a yellow and a black spot) |
Clean tank (cleanroom B1, 7-up bath for wafers) and make your own or make in dedicated glass.
Pour up H2SO4 first, put wafers in carrier (USE this in steps 2-7), add H2O2, wait 30 sec, dip wafers. |
Maybe clean the tank the day before! |
| 3 | Rinse | 2 min. rinse | . | Put into dedicated wet box for IMEC |
| 4 | IMEC | DI water:5% HF:isopropanol (100:10:1)
Temp: 25 oC Time: 100 sec (two black spots) |
Clean tank (cleanroom D-3, tank for buffer with wetting solution) and make your own. Mix in dedicated bottle (IMEC) in fume hood and add to tank using BHF pump from RCA fumehood! |
. |
| 5 | Rinse | 2 min. rinse | Put into dedicated wet box for IMEC | . |
| 6 | Piranha | Not nitride wafers!
Mixture: H2SO4:H2O2 (4:1) Temp: 80 oC Time: 20 min |
Re-use previous piranha
Makes wafers hydrophilic |
. |
| 7 | Rinse & spin dry | 5 min rinse | . | . |
| 8 | Put wafers in new clean carrier box | . | . | . |