Specific Process Knowledge/Characterization/Topographic measurement

From LabAdviser

Topographic measurements are measurements were you can measure hight differences on your substrate. If you measure in many spots of you substrate you can get a topographic image of your substrate.

AT DANCHIP we have three systems for topographic measurement:

  • Tencor - Profiler for measuring micro structures
  • Dektak - Profiler for measuring micro structures
  • Nanoman - AFM for measuring nano structures

High Aspect ratio structures
The fact that the tips of the profilers and the AFM are shaped like a cone with some tip angle causes a problem when characterizing high aspect ratio structures. For instance, if a 20 Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle \mu} m wide trench is etched deeper than approximately 18 Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle \mu} m, the tip of the Dektak will not be able to reach the bottom. In this case the only solution is to cleave the sample along a line that is perpendicular to the trench and then put it in a scanning electron microscope.


Comparison of the two profilers and the AFM

. Tencor Dektak Nanoman
General description Profiler for measuring micro structures Profiler for measuring micro structures. Can do wafer mapping and stress measurements. AFM for measuring nanostructures and surface roughness
Substrate size small pieces -> 4" 2" -> 8" 6" or less
Max. scan range xy Line scan x: Full substrate size Line scan x: 50µm to 200mm 90 µm square
Max. scan range z <100Å to~0.3mm 50Å to 262µm 1 µm (can go up to 5 µm under special settings)
Resolution xy up to 5900 data points per profile down to 0.067 µm Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
Resolution z 1Å or 25Å 1Å, 10Å or 20Å <1Å - accuracy better than 2%
Max. scan depth [µm] (as a function of trench width W) 0.87(W[µm]-5µm) 1.2(W[µm]-5µm) ~1 with standard cantilever.
Tip radius 5 µm 60o cone 5 µm 45o cone <12 nm on standard cantilever
Stress measurement Can be done Can be done Cannot be done
Surface roughness Can be done on a line scan Can be done on a line scan Can be done on a selected surface area