Specific Process Knowledge/Thin film deposition/Deposition of Alumina

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Deposition of aluminium oxide

Aluminium oxide (Alumina, Al2O3 ) can be deposited by use of ALD (atomic layer deposition) or by a sputter technique in the Lesker Sputter System or the Cryofox PVD co-sputter/evaporation. During the sputter deposition oxygen is added to the chamber resulting in aluminium oxide on the sample

Comparison of the methods for deposition of Alumium Oxide

Sputter System Lesker Cryofox PVD co-sputter/evaporation ALD Picosun 200
Generel description
  • RF sputtering from Al2O3 target
  • Reactive Sputtering (never tested)
  • Reactive Sputtering
  • ALD (atomic layer deposition) of Al2O3
Stoichiometry
  • Not tested
  • Not tested
  • Al2O3, very good
Film Thickness
  • 0nm - 200nm
  • 0nm - 200nm
  • 0nm - 100nm
Deposition rate
  • 0,3nm/min
  • Not tested
  • 0.88 - 0.97 nm/cycle (Using the "Al2O3" recipe, temperature dependent)
Step coverage
  • unknown
  • Very good
  • Very good. Covers sample everywhere (but long purge time needed for very high aspect ratio structures)
Process Temperature
  • Up to 450oC
  • Up to 400oC
  • 150oC - 350oC:
More info on Al2O3
  • -
Substrate size
  • chips
  • 1x 100 mm wafer
  • 1x 150 mm wafer
  • 100 mm wafers (Up to 12 wafers at a time)
  • 150 mm wafers (Up to 4 wafers at a time)
  • 1-5 100 mm wafers
  • 1-5 150 mm wafers
  • Several smaller samples
Allowed materials
  • almost any
  • Silicon
  • Silicon oxide, silicon nitride
  • Quartz/fused silica
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Any metals
  • Silicon
  • Silicon oxide, silicon nitride
  • Quartz/fused silica
  • Al, Al2O3
  • Ti, TiO2
  • Other metals (use dedicated carrier wafer)
  • III-V materials (use dedicated carrier wafer)
  • Polymers (depending on the melting point/deposition temperature, use carrier wafer)