Specific Process Knowledge/Thin film deposition/Deposition of Silver
Feedback to this page: click here
Deposition of Silver
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
Sputter deposition of Silver
- Sputter deposition of Silver in PVD so-sputter/evaporation.
- Sputter deposition of Silver in Wordentec.
Thermal deposition of Silver
E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | E-beam evaporation (Physimeca) | Sputter evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec) | Sputter deposition (Lesker) | E-beam evaporation (III-V Dielectric evaporator) | |
---|---|---|---|---|---|---|---|---|
General description | E-beam deposition of Ag | Thermal deposition of Ag | E-beam deposition of Ag | E-beam deposition of Ag | Sputter deposition of Ag | Sputter deposition of Ag | Sputter deposition of Ag | E-beam deposition of Ag |
Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
Layer thickness | 10Å to 1µm* | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 1000Å | 10Å to 2000Å | 10Å to about 5000Å | 10Å to about 3000Å | 10Å to about 1000Å | 10Å to about 1000Å |
Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | About 1Å/s | 1 to 10Å/s | Dependent on process parameters. | Depending on process parameters (also written in the logbook). | Dependent on process parameters. | 2 Å/s to 5 Å/s |
Batch size |
|
|
|
|
|
|
|
|
Allowed materials |
|
|
|
|
|
|
|
|
Comment | Only very thin layers. | Only very thin layers (up to 100nm). |
* For thicknesses above 200 nm permission is required.