Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes

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Overview of the standard processes: Processes A, B, C, D and SOI

The instrument was accepted on the basis of the performance of 5 processes. Below is a general comparison - to find more detailed information, go the web page for each process

Standard processes on the DRIE-Pegasus
Process name Type Purpose Conditions during original runs Best usage
Feature Mask material Etch load Comments
Process A Bosch Fast etch 80 µm trench Photo resist 12-13 % on 6" wafer
Process B Bosch Fast etch 30 µm diameter via Photo resist 12-13 % on 6" wafer



Equipment Equipment 1 Equipment 2
Purpose
  • Purpose 1
  • Purpose 2
  • Purpose 1
  • Purpose 2
  • Purpose 3
Performance Response 1
  • Performance range 1
  • Performance range 2
  • Performance range 1
  • Performance range 2
  • Performance range 3
Response 2
  • Performance range
  • Performance range
Process parameter range Parameter 1
  • Range
  • Range
Parameter 2
  • Range
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3