Specific Process Knowledge/Wafer cleaning/RCA
RCA cleaning
The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet). It consist of two solutions: RCA1 and RCA2 plus diluted HF.
The RCA1 contains: HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2}
O, NHFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _4}
OH and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2}
OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2}
(5:1:1). It is used for removed of light organics, particles and metal.
The RCA2 contains: HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2}
0, HCl and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2}
OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2}
(5:1:1). It is used for removal of heavy metals, alkalies and metal hydroxides.
RCA procedure
- RCA1: 10 min
- DI wafer rinsing (dumping three times)
- HF: 30 sec (avoid it if you have oxide as the top layer)
- DI wafer rinsing (dumping three times)
- RCA2: 10 min
- DI wafer rinsing (dumping three times)
- HF: 30 sec (avoid it if you have oxide as the top layer)
- DI wafer rinsing (dumping three times)
Overview of RCA process data
| RCA1 | RCA2 | HF | |
|---|---|---|---|
| General description |
It is used for removal of light organics, particles and metal. |
It is used for removal of light organics, particles and metal. |
It is used for removal of oxide generated in RCA1 and RCA2 |
| Chemical solution | HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O, NHFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _4} OH(29%) and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} (30%) (5:1:1) | HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O, HCl(37%) and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} (30%) (5:1:1) | 5% HF |
| Process temperature | 70-80 oC | 70-80 oC | Room temperature |
| Process time |
10 min. |
10 min. |
30 sec. |
| Allowed materials |
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| Batch size |
1-25 4" or 6" wafers at a time |
1-25 4" or 6" wafers at a time |
1-25 4" or 6" wafers at a time |
| Size of substrate |
4"-6" wafers |
4"-6" wafers |
4"-6" wafers |