Specific Process Knowledge/Thin film deposition/Deposition of Aluminium Nitride

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Deposition of Aluminium Nitride

AlN can be deposited by using sputtering method with AlN target or reactive sputtering method with Al target in mixtures of argon and nitrogen. AlN film can be deposited by using the Cryofox PVD co-sputter/evaporation) or the Lesker Sputter System.



Only one method at the moment

Cryofox PVD co-sputter/evaporation
Generel description
  • Reactive Sputtering (Al target) or AlN target sputtering
Stoichiometry
  • Depend on the targets power
Film Thickness
  • 0nm - 200nm
Deposition rate
  • Not tested
Step coverage
  • Very good
Process Temperature
  • Up to 400oC
Substrate size
  • 100 mm wafers (Up to 12 wafers at a time)
  • 150 mm wafers (Up to 4 wafers at a time)
Allowed materials
  • Silicon
  • Silicon oxide, silicon nitride
  • Quartz/fused silica
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Any metals