Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 1/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004671 | New showerhead |
No SEM images due to bad cleaving |