Specific Process Knowledge/Thin film deposition/Deposition of Gold

From LabAdviser
4th Level - Comparison

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Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter (Lesker) Sputter coater Hummer Sputter coater Balzer
General description E-beam deposition of Au E-beam deposition of Au Sputter deposition of Au Sputter deposition of Au Sputter deposition of Au
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10 Å to 5000Å* 10 Å to 5000Å* 10 Å to
Deposition rate 2 Å/s to 10 Å/s 1 Å/s to 10 Å/s Not measured Not measured
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • Pieces or
  • 1x4" wafer or
  • 1x6" wafer
  • 1x4" wafer
  • Several smaller samples
  • 1 large sample (< 4" wafer)
  • Several smaller samples
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Carbon
. .
Comment
  • For thicknesses above 200 nm permission is required
  • An adhesion layer (of Cr or Ti) is recommended under Au.
  • For thicknesses above 200 nm permission is required
  • An adhesion layer (of Cr or Ti) is recommended under Au.
Used to gold sputter coating of

samples mainly before SEM characterization

Used to gold sputter coating of

samples mainly before SEM characterization


* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

Adhesion of Au on Si

Adhesion of Au layers


Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings