Specific Process Knowledge/Lithography/Coaters

SSE Spinner

The SSE spinner MAXIMUS: positioned in Cleanroom 13.

Process information

Link to process pages

• Positive process with AZ5214E resist
• Reverse process with AZ5214E resist
• Positive process with AZ4562 resist
• E-beam process with ZEP 520A resist

Information about resist can be found here:

• AZ5214E
• AZ4562
• ZEP520A

KS Spinner

The KS spinner is placed in Cleanroom 3.

Process information

Link to process pages

• Positive process with AZ5214E resist
• Reverse process with AZ5214E resist
• Positive process with AZ4562 resist
• Process with SU8 resist

Information about resist can be found here:

• AZ5214E
• AZ4562
• SU8 2005
• SU8 2075

Manual Spinner( Polymers)

The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.

The Manual Spinner(Polymers), Opticoat SB20+, from SSE Sister Semiconductor Equipment, are dedicated for spinning of imprint polymers, e-beam resist in small batches, SU8 resist and other polymers with extra addictive like color, nano particles etc.

There are 2 hotplates with temperature range up to 250C, placed in the same fumehood, which can be used for baking before/after spinning.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

Process information

Link to process pages

SÜSS Spinner-Stepper

The SÜSS Spinner-Stepper is placed in Stepper room.

This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size. The machine is equipped with the 3 resist lines, a automatic syringe system and a solvent line for cleaning and back-side rinse.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

Information about resist can be found here:

• Bottom Anti Reflection Coating (BARC)DUV 42S-6 .
• Datasheet DUV42S-6.
• Positive DUV resist for spinning in 300-600 thickness range KRF M230Y.

Process information

Link to process pages

Equipment performance and process related parameters

Equipment		SSE Spinner	KS Spinner
Purpose		Spinning and baking of AZ2514E resist Spinning and baking of AZ4562 resist Spinning and baking of e-beam resist	Spinning and baking of AZ2514E resist Spinning and baking of AZ4562 resist Spinning and baking of SU8 resist
Performance	Substrate handling	Cassette-to-cassette Edge handling chuck	Single substrate Non-vacuum chuck for fragile substrates
	Permanent media	AZ5214E resist AZ4562 resist Acetone for chuck cleaning Acetone for drip pan	AZ5214E resist PGMEA for edge bead removal Acetone for chuck cleaning
	Manual dispense option	2 automatic syringes	yes pneumatic dispense for SU8 resist
Process parameter range	Parameter 1	Range	Range
	Parameter 2	Range	Range
Substrates	Batch size	24 50 mm wafers 24 100 mm wafers 24 150 mm wafers	1 100 mm wafers 1 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3