Specific Process Knowledge/Back-end processing/Polymer Injection Molder
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Polymer injection molding
The injection molder at Danchip is an Engel Victory Tech 80/45. It is hydraulic machine capable of up to 450 kN of clamping force.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Polymer injection molding Info on LabManager
Process information
There are no standard processes on the injection molder, since the type of process chosen and process parameters will depend on which polymer that will be used and what type of pattern that is to be replicated during the molding process.
At Danchip the following polymers are used routinely:
Topas 5013L-10 Topas 8007S-04
Some other polymers are used occasionally, such as Polypropylene and Polystyrene. Other polymers can be used after approval and small batches of other polymers are available. Please ask Danchip for details.
Generally two different types of processes are run at Danchip: Constant temperature processes and variotherm processes. An overview of these two processes are given in the table below.
| Parameter | Value | |
|---|---|---|
| Sample dimensions | Diameter |
50, 100 or 150 mm (~ 2", 4" or 6") |
| Sample thickness |
Maximum 1,0 mm | |
| Process parameters | Temperature |
52*C |
| pH |
3,5 - 3,8 | |
| Sample requirements | Seed metal |
100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the Sputter-System(Lesker). |
| Allowed materials |
Most materials allowed. See below. | |
| Forbidden materials |
Copper, cobalt. See machine manual on LabManager for details | |